Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity

Shuilai Qiu; Hang Wu; Fukai Chu; Lei Song

doi:10.1016/j.cjche.2024.01.012

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Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity

Updated：2026-01-06

- Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity
- Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity
- 中国化学工程学报（英文版） 2024年68卷第4期页码：224-230
- Affiliations：
  
  1. College of Safety and Ocean Engineering, China University of Petroleum-, Beijing,Beijing,China,102249
  2. State Key Laboratory of Fire Science, University of Science and Technology of China,Hefei,China,230026
- Author bio：
- Funds：
- DOI：10.1016/j.cjche.2024.01.012
  中图分类号：
- 纸质出版：2024
- Accepted：
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Shuilai Qiu, Hang Wu, Fukai Chu, 等. Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity[J]. 中国化学工程学报（英文版）, 2024,68(4):224-230.

Shuilai Qiu, Hang Wu, Fukai Chu, Lei Song. Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity[J]. Chinese Journal of Chemical Engineering, 2024, 68(4): 224-230.
Shuilai Qiu, Hang Wu, Fukai Chu, 等. Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity[J]. 中国化学工程学报（英文版）, 2024,68(4):224-230. DOI： 10.1016/j.cjche.2024.01.012.

Shuilai Qiu, Hang Wu, Fukai Chu, Lei Song. Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity[J]. Chinese Journal of Chemical Engineering, 2024, 68(4): 224-230. DOI： 10.1016/j.cjche.2024.01.012.

摘要

Abstract

Silicone rubber (SR) is widely used in the field of electronic packaging because of its low dielectric properties. In this work

the porosity of the SR was improved

and the dielectric constant of the SR foam was reduced by adding expanded microspheres (EM). Then

the thermal conductivity of the system was improved by combining the modified boron nitride (f-BN). The results showed that after the f-BN was added

the dielectric constant and dielectric loss were much lower than those of pure SR. Micron-sized modified boron nitride (f-mBN) improved the dielectric and thermal conductivity of the SR foam better than that of nano-sized modified boron nitride (f-nBN)

but f-nBN improved the volume resistivity

tensile strength

and thermal stability of the SR better than f-mBN. When the mass ratio of f-mBN and f-nBN is 2:1

the thermal conductivity of the SR foam reaches the maximum value of 0.808 W·m

-1

·K

-1

which is 6.5 times that before the addition. The heat release rate and fire growth index are the lowest

and the improvement in flame retardancy is mainly attributed to the high thermal stability and physical barrier of f-BN.

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