Your Location:
Home >
Browse articles >
Numerical modeling of SiC by low-pressure chemical vapor deposition from methyltrichlorosilane
Materials and Product Engineering | Updated:2026-01-06
    • Numerical modeling of SiC by low-pressure chemical vapor deposition from methyltrichlorosilane

    • Chinese Journal of Chemical Engineering   Issue 6, Pages: 1733-1743(2020)
    • DOI:10.1016/j.cjche.2020.03.035    

      CLC:
    • Published:2020

    Scan QR Code

  • Kang Guan, Yong Gao, Qingfeng Zeng, et al. Numerical modeling of SiC by low-pressure chemical vapor deposition from methyltrichlorosilane[J]. Chinese Journal of Chemical Engineering, 2020, (6): 1733-1743. DOI: 10.1016/j.cjche.2020.03.035. DOI:

  •  
  •  
icon
The trial reading is over, you can activate your VIP account to continue reading.
Deactivate >
icon
The trial reading is over. You can log in to your account, go to the personal center, purchase VIP membership, and read the full text.
Already a VIP member?
Log in >

0

Views

2

Downloads

0

CSCD

Alert me when the article has been cited
Submit
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Uniform deposition of ultra-thin TiO2 film on mica substrate by atmospheric pressure chemical vapor deposition: Effect of precursor concentration
Technical Challenges and Progress in Fluidized Bed Chemical Vapor Deposition of Polysilicon
Boron Nitride Nanowires Produced on Commercial Stainless Steel foil
Kinetic and Microstructure of SiC Deposited from SiCl4-CH4-H2
Recovery rubidium chloride and cyclic utilization of hexacyanoferrate(II) ion from hexacyanoferrate-internediate solutions via solvent extraction

Related Author

Qingshan Zhu
Jun Li
Pengpeng Lv
Guoqiang Shao
Rui Wang
Ying Li
Ming Liu
王伟文

Related Institution

State Key Laboratory of Multiphase Complex Systems, Institute of Process Engineering, Chinese Academy of Sciences
School of Chemical & Environmental Engineering, China University of Mining and Technology-, Beijing
School of Chemical Engineering, University of Chinese Academy of Sciences
Institute of Chemical Engineering, Qingdao University of Science and Technology
Institute of Electromechanical Engineering, Qingdao University of Science and Technology
0