Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion

龚志金; 王建莉; 吴丽梅; 王小雨; 吕国诚; 廖立兵

doi:10.1016/S1004-9541(13)60569-8

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Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion

能源、资源与环境技术 | Updated：2026-01-06

- Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion
- Chinese Journal of Chemical Engineering Vol. 21, Issue 8, Pages: 920-9261004-954160569-8(2013)
- Affiliations：
  
  2 Chemistry Institute Co., Ltd., Henan Academy of Sciences,Zhengzhou,China,450002
- Author bio：
- Funds：
- DOI：10.1016/S1004-9541(13)60569-8
  CLC：
- Published：2013
- Accepted：
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GONG Zhijin, WANG Jianli, WU Limei, WANG Xiaoyu, LÜ Guocheng, LIAO Libing. Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion[J]. Chin.J.Chem.Eng., 2013, 21(8): 920-926.
DOI：

GONG Zhijin, WANG Jianli, WU Limei, WANG Xiaoyu, LÜ Guocheng, LIAO Libing. Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion[J]. Chin.J.Chem.Eng., 2013, 21(8): 920-926. DOI： 10.1016/S1004-9541(13)60569-8.

摘要

Abstract

Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy (SEM)

X-ray diffraction (XRD)

energy dispersive spectrometer (EDS) and water contact angle measurements were used to investigate the morphologies

microstructures

chemical compositions and hydrophobicity of the produced films on copper substrates

respectively. Results show that the super hydrophobic surface is composed of micro structure of Cu

. The films present a high water contact angle larger than 150°

a low sliding angle less than 3°

good abrasion resistance and storage stability. The molecular dynamics simulation confirms that N-dodecyl mercaptan molecules link up with Cu

admirably

compared with Cu

which contributes to the stable super hydrophobic surface.

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