Effect of copper nanoparticles on thermal behavior of two-phase argon-copper nanofluid flow in rough nanochannels with focusing on the interface properties and heat transfer using molecular dynamics simulation
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Effect of copper nanoparticles on thermal behavior of two-phase argon-copper nanofluid flow in rough nanochannels with focusing on the interface properties and heat transfer using molecular dynamics simulation
Chinese Journal of Chemical EngineeringVol. 42, Issue 2, Pages: 344-350(2022)
Affiliations:
1. Department of Mechanical Engineering, Amirkabir University of Technology, Tehran,Iran
2. Department of Mechanical Engineering, Amirkabir University of Technology, Hafez Ave., P.O. Box 115916-3431, Tehran,Iran
3. Energy Research Center, Amirkabir University of Technology, Hafez Ave., P.O. Box 115916-3431, Tehran,Iran
4. Department of Mechanical Engineering, Khomeinishahr Branch, Islamic Azad University, Khomeinishahr,Iran
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Published:2022
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Shabnam Ghahremanian, Abbas Abbassi, Zohreh Mansoori, Davood Toghraie. Effect of copper nanoparticles on thermal behavior of two-phase argon-copper nanofluid flow in rough nanochannels with focusing on the interface properties and heat transfer using molecular dynamics simulation[J]. Chinese Journal of Chemical Engineering, 2022, 42(2): 344-350.
DOI:
Shabnam Ghahremanian, Abbas Abbassi, Zohreh Mansoori, Davood Toghraie. Effect of copper nanoparticles on thermal behavior of two-phase argon-copper nanofluid flow in rough nanochannels with focusing on the interface properties and heat transfer using molecular dynamics simulation[J]. Chinese Journal of Chemical Engineering, 2022, 42(2): 344-350.DOI:
Effect of copper nanoparticles on thermal behavior of two-phase argon-copper nanofluid flow in rough nanochannels with focusing on the interface properties and heat transfer using molecular dynamics simulation
A comparison between the efficacy of surface boundary structure and presence of nanoparticles on the condensation two-phase flow inside rough nanochannels has been accomplished by applying molecular dynamics procedure to evaluate the thermal conductivity and flow characteristics. Simulation is performed in a computational region with two copper walls containing rectangular rough elements under different saturated temperatures. The main properties of liquid-vapor interface including density and the number of liquid atoms
are obtained. It is observed that the density profile is more affected by nanoparticles than the roughness. Also
compared to the condensation of nanofluid in a smooth nanochannel
the rough wall causes a greater drop in the temperature at the early time steps and by development of liquid films
effects of the wall roughness reduce. At the first of the condensation process
adding nanoparticle causes that transferring argon particles to the liquid phase increases with a steeper slope. Furthermore
heat current autocorrelation function (HCACF) for nanofluid condensation flow over considered correlation time is analyzed and following that the thermal conductivity for different saturated conditions is calculated. It has been represented that at lower temperatures the roughness makes more significant influence on the heat transfer of two-phase flow
while at higher temperatures the importance of nanoparticles prevails.
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